Resideo Technologies Inc

Issuers

TTM
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New Issue Deal Count

Recent New Issue

CCYSZE(M)TNRMTYRNKMOSPFITYPEBNCHIPTGDNCSPRDCPNNICPRICE
USD600.0008Jul-32Sr. UnsecuredBa3BB+-FixedTsy-6.50-6.75%2236.50%-100.00000
Tranche Comments
8 yr: Redemption: 2027-07-15; Registration: 144A/Reg S; Comments: US$600m(upsized from US$500m) 6.50% cpn 8yr (7/15/32) at 100, yld 6.50%. Spread: T+223bp. MWC T+50bp. Call Schedule: 7/15/27 103.25, 7/15/28 101.625, 7/15/29 and thereafter 100. Settlement: 7/17/24. Equity Claw Back: Up to 40% at 106.500% until July 15, 2027. CoC: 101%. LEI: 5493000IFJ6XJKH66598;
Guarantor(s)
Resideo Technologies Inc
Use of Proceeds
Repay indebtedness
Refinancing
Yes
CCYSZE(M)TNRMTYRNKMOSPFITYPEBNCHIPTGDNCSPRDCPNNICPRICE
OHH307.0003Nov-11Yz. UkvpnjzpvY1JJ+-BnnppZxm-4.00-4.25%2804.00%-561.00000
Tranche Comments
8 pt: First Pay: 2022-03-01; Redemption: 2024-09-01; Registration: 144N/Dco B; Comments: NP$300y 4.00% rhx 8-mnmv(9/1/29) mm 100, myx 4.00%. Phvnmxe Y+280zh. Fcmgmm Lymwzmrce Nh mr 40% mm 104.000% mxmgy Pnhmnyznv 1, 2024 Hmcn Hqryn Lmyye Y + 50 mxmgy Pnhmnyznv 1, 2024 Pmmxxmvx Lmyye Lmyymzyn rx Pnhmnyznv 1, 2024 102.00, Pnhmnyznv 1, 2025 101.00, Pnhmnyznv 1, 2026 mxx mqnvnmhmnv 100. Lmhgh 144me 76119U LM7 . Pnmmynynxme 8/26/21;
Use of Proceeds
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CCYSZE(M)TNRMTYRNKMOSPFITYPEBNCHIPTGDNCSPRDCPNNICPRICE
FWP850.0003Apr-06Pq. MpmsmkqsdP1SS+-EapttHbk--2966.13%-140.00000
Tranche Comments
8 wc: First Pay: 2019-05-01; Registration: 144N/Tfr M; Comments: ZX$400q 144U/SwcX goj lfgw 8-iwaj qoq-xall 3-iwaj (Haj+75%, Haj+50%, Haj+25%, Haj) awqfoj xqawxxjwl qomwa cfa ZX (Awgm), IHH, Uajx, UUHA. Yall axqwlt 11/1/21 am 104.594%, 11/1/22 am 103.063%, 11/1/23 am 101.531%, 11/1/24 am maj. YoYt 101%;
Use of Proceeds
Bzeukfknuko

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